Hisense

Hisense A9 Pro

Name: Hisense A9 Pro
Brand: Hisense

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L'essentiel

Écran: 6.1″; eInk E INK Carta 1200
Processeur: Qualcomm Snapdragon 662
Mémoire: 8 GB RAM; 256GB
Batterie: 4000 mAh
Photo: 13 MP; selfie 5 MP
Logiciel: Android 12 Snow Cone Android 12

Fiche technique complète

Technical sheet

Brand

Brand: HiSense
Best Sellers: HiSense L676 HiSense A7 HiSense A6 HiSense Infinity H50 Hisense E50

Release Date

Release date: March 2023, 3 years ago

Design & Materials

Image gallery

Image gallery

Structure

Size: 79.5 mm • 159.0 mm • 7.8 mm

Weight

183 g

Usable surface

76 %

Materials

Plastic

Colors

Black

Screen

Diagonal: 6.1"
Type: eInk E INK Carta 1200
Aspect Ratio: 18:9
Resolution: 824 x 1648 px • FHD
Density: 302 ppi • High Density
Others: Water Drop Notch Capacitive Multi-touch Frameless

Performance & Hardware

Processor

Model: Qualcomm Snapdragon 662
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Type: Octa-Core
Nanometer: 11 nm
Frequency: 2 GHz
64 Bits: Yes

Graphics

GPU: Qualcomm Adreno 610

RAM

RAM: 8 GB
Type: --

Antutu

Score: 102.000 • Antutu v9 Overall performance better than 52% of devices

Storage

Capacity: 256 GB
SD Slot: Yes , Slot for SD or second SIM card

Security

Fingerprint: Yes, on the side

Sensors

Fingerprint: No
Proximity: Yes
Light sensor: Yes
Accelerometer: Yes
Audio: Stereo Speakers
Notifications LED: --
Cooling system: No
Gaming buttons: No

Camera

Triple rear camera

Standard: 1
Resolution: 13 Mpx
Aperture: Unknow
Sensor: --
Type: CMOS
Pixel size: --
Flash: LED
Optical Stabilisation: No
Slow Motion Video: No, 30 fps
Features: Digital zoom Autofocus Touch focus Manual focus Continuous shooting Geotagging HDR White balance settings ISO settings Exposure compensation Scene mode Self-timer

Selfie

Resolution: 5 Mpx
Aperture: ƒ/ 2.0
Sensor: --
Type: CMOS
Pixel size: --

Connectivity

Bands

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900)

SIM card

Type: Dual SIM Dual Standby (Nano SIM + Nano SIM) SIM cards (MiniSIM) can be cut to MicroSIM, MicroSIM can be cut to NanoSIM and a SIM can even be cut to a NanoSIM (although not recommended). Download this SIM Cutting Template and forget about having to ask your operator for a new SIM...

Wi-Fi

Standards: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Others: Dual band Wi-Fi Hotspot

Bluetooth

Version: Bluetooth 5.1
Profiles: A2DP (Advanced Audio Distribution Profile) APT-x LDAC SBC AAC

Navigation

Supports: GPS, A-GPS

USB

Charging: Yes
Mass Storage: Yes
USB On-The-Go (OTG): Yes
USB Type C: Yes

SAR

--: --

Battery

Capacity: 4000 mAh
Type: Li-Ion
Fast charge: No
Others: Non-removable

Software

Operating System: Android 12 Snow Cone Android 12
Google Services: With Google Mobile Services

Technical sheet

Brand

Brand: HiSense
Best Sellers: HiSense L676 HiSense A7 HiSense A6 HiSense Infinity H50 Hisense E50

Release Date

Release date: March 2023, 3 years ago

Design & Materials

Image gallery

Image gallery

Structure

Size: 79.5 mm • 159.0 mm • 7.8 mm
Weight: 183 g
Usable surface: 76 %
Materials: Plastic
Colors: Black

Screen

Diagonal: 6.1"
Type: eInk E INK Carta 1200
Aspect Ratio: 18:9
Resolution: 824 x 1648 px • FHD
Density: 302 ppi • High Density
Others: Water Drop Notch Capacitive Multi-touch Frameless

Performance & Hardware

Processor

Model: Qualcomm Snapdragon 662
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Type: Octa-Core
Nanometer: 11 nm
Frequency: 2 GHz
64 Bits: Yes

Graphics

GPU: Qualcomm Adreno 610

RAM

RAM: 8 GB

Camera

Triple rear camera

Standard: 1
Resolution: 13 Mpx
Aperture: Unknow
Sensor: --
Type: CMOS
Pixel size: --
Flash: LED
Optical Stabilisation: No
Slow Motion Video: No, 30 fps

Connectivity

Bands

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900)

SIM card

Type: Dual SIM Dual Standby (Nano SIM + Nano SIM) SIM cards (MiniSIM) can be cut to MicroSIM, MicroSIM can be cut to NanoSIM and a SIM can even be cut to a NanoSIM (although not recommended). Download this SIM Cutting Template and forget about having to ask your operator for a new SIM...

Wi-Fi

Standards: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Others: Dual band Wi-Fi Hotspot

Battery

Capacity: 4000 mAh
Type: Li-Ion
Fast charge: No
Others: Non-removable

Software

Operating System: Android 12 Snow Cone Android 12
Google Services: With Google Mobile Services

Caractéristiques clés

Le classement de ce téléphone face aux 352 téléphones avec prix sur Unboxing TN.

Batterie
4 000 mAh
Supérieur à 2 % du catalogue
Photo
13 MP
Supérieur à 5 % du catalogue
RAM
8 GB
Supérieur à 36 % du catalogue
Stockage
256GB
Supérieur à 45 % du catalogue

Type

--

Antutu

Score: 102.000 • Antutu v9 Overall performance better than 52% of devices

Storage

Capacity: 256 GB
SD Slot: Yes , Slot for SD or second SIM card

Security

Fingerprint: Yes, on the side

Sensors

Fingerprint: No
Proximity: Yes
Light sensor: Yes
Accelerometer: Yes
Audio: Stereo Speakers
Notifications LED: --
Cooling system: No
Gaming buttons: No

Features

Digital zoom Autofocus Touch focus Manual focus Continuous shooting Geotagging HDR White balance settings ISO settings Exposure compensation Scene mode Self-timer

Selfie

Resolution: 5 Mpx
Aperture: ƒ/ 2.0
Sensor: --
Type: CMOS
Pixel size: --

Bluetooth

Version: Bluetooth 5.1
Profiles: A2DP (Advanced Audio Distribution Profile) APT-x LDAC SBC AAC

Navigation

Supports: GPS, A-GPS

USB

Charging: Yes
Mass Storage: Yes
USB On-The-Go (OTG): Yes
USB Type C: Yes

SAR

--: --

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Hisense A9 Pro

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L'essentiel

Fiche technique complète

Technical sheet

Design & Materials

Performance & Hardware

Camera

Connectivity

Battery

Software

Technical sheet

Design & Materials

Performance & Hardware

Camera

Connectivity

Battery

Software

Caractéristiques clés