Samsung's next flagship may finally bring Exynos back to the Ultra line. According to Android Authority, an Exynos-powered Galaxy S27 Ultra is now more likely than ever, with the report pointing the finger at Qualcomm's Snapdragon pricing as a key factor pushing Samsung toward its own silicon.
The claim lands alongside fresh leaks about the phone's design. Tipster Ice Universe says the Galaxy S27 Ultra will have slightly thicker bezels and a thicker rear camera bump than the Galaxy S26 Ultra, while keeping almost the same overall dimensions.
Galaxy S27 Ultra leaks: bezels and camera bump
According to GSMArena, Ice Universe claims the Galaxy S27 Ultra will feature 1.28mm-thick display bezels, up from 1.15mm on the current Galaxy S26 Ultra. The rear camera bump is also tipped to grow to 4.69mm, compared to 4.5mm on the S26 Ultra.
The tipster suggests a redesigned rear camera module could explain the thicker bump. None of this has been confirmed by Samsung, so treat the numbers as rumors for now.
- Display bezels: 1.28mm (S26 Ultra: 1.15mm)
- Rear camera bump: 4.69mm (S26 Ultra: 4.5mm)
- Dimensions: 163.76 x 78.25 x 7.97 mm
- Weight: 218 grams
- Cameras: 200MP main, 50MP ultrawide, 50MP telephoto with 5x optical zoom
